Polyimide
For projects evaluating elevated-temperature performance, thermal cycling and plated-through-hole reliability.
Explore selection criteria ↗Arlon PCB · From material to manufacturing
Arlon PCB material selection, fabrication planning and practical design support for demanding electronics.
Start with the operating environment. Define the laminate, stack-up and finish. Bring a better-specified project to manufacturing.

01 / Material families
Arlon EMD's laminate and prepreg families serve different fabrication needs. Select a named grade against the actual design requirements.
For projects evaluating elevated-temperature performance, thermal cycling and plated-through-hole reliability.
Explore selection criteria ↗For controlled resin movement around rigid-flex openings, bonded features and selective constructions.
Explore selection criteria ↗Evaluate thermal requirements, dimensional behavior, reinforcement and assembly compatibility.
Explore selection criteria ↗02 / Engineering workbench
Explore gold-thickness units, identify the inputs that affect PCB cost, and build a material-review checklist before requesting a quotation.
Planning tools, not manufacturing approval. Final material, finish and acceptance criteria must be agreed for each build.
1 µin = 0.0254 µm exactly. ENIG, ENEPIG and electrolytic hard gold serve different purposes. A unit conversion does not establish a suitable finish or thickness.
This tool explains cost drivers. It does not generate a price or an unverified multiplier.
Track what is ready for technical review.
03 / Applications
Temperature alone is not a material specification. Account for cycling, moisture, mechanical loads and the assembly process.
Evaluate duty cycle, service temperature and long-term maintenance.
Plan application requirements ↗Define traceability, test coverage and program qualification requirements.
Plan application requirements ↗Review prolonged thermal exposure, sockets and repeated test cycles.
Plan application requirements ↗Match construction and documentation to the device-level quality plan.
Plan application requirements ↗Assess vacuum, thermal cycling and mission-specific material requirements.
Plan application requirements ↗Coordinate bend geometry, low-flow bonding and transition regions.
Plan application requirements ↗04 / A clearer manufacturing handoff
Document the grade, geometry, stack-up and intended operating conditions.
Resolve open questions about vias, resin flow, finish and test requirements.
Confirm the build specification, material availability and commercial quotation.
Use the agreed inspection and test plan to establish acceptance.
05 / Questions before fabrication
The phrase commonly describes a printed circuit board made with a specified Arlon laminate or prepreg. It is not one universal material specification. Name the exact grade and confirm its current manufacturer documentation before fabrication.
No. Arlon PCB is an independent PCB manufacturer. Product names are used to identify materials; they do not imply authorization, ownership or affiliation with the material manufacturer.
No. Glass transition temperature is one material characteristic. Continuous exposure, decomposition behavior, expansion, moisture, assembly cycles and application qualification must also be considered.
State the finish system, thickness units, measurement method and applicable acceptance criteria. Immersion gold and wear-resistant hard gold are not interchangeable simply because their thickness is similar.
The selected grade, panel utilization, layer count, copper distribution, via structure, surface finish, test coverage, quantity and delivery requirement all influence the review. A fabrication package is needed for a meaningful quotation.
Additional fabrication perspectives: material-to-fabrication planning considerations and specialty laminate manufacturing guidance.
Your next board starts here
Use one inquiry form to share project requirements and fabrication files.