Arlon PCBPCBSync Engineering Tools
Arlon PCBPCBSync Engineering Tools
Every Arlon laminate part number, every datasheet — in one place. Browse the full AD, CLTE, DiClad, CuClad, TC and polyimide material library, run live microstrip impedance & cost calculations, and ship better RF / high-temperature boards.
Engineered for RF, microwave and high-reliability PCB designers. Built & maintained by PCBSync — Arlon PCB · fabrication-verified specs.
Search and filter the complete Arlon laminate & prepreg catalog. Click any part number for full electrical, thermal and mechanical specs plus recommended applications. (Arlon's circuit-materials line is now part of Rogers Corp — values shown are typical published datasheet figures; always confirm against current manufacturer specs for production.)
Three working tools tuned to Arlon's tight dielectric tolerances: microstrip impedance, a layer-stack cost estimate, and a side-by-side comparison matrix. All run in your browser — no data leaves this page.
Hammerstad–Jensen microstrip model. For controlled impedance production, allow ±5% and request lot impedance testing. Arlon Dk tolerance is typically ±0.04 vs ±0.2 for FR-4.
Order-of-magnitude estimate only. Real pricing depends on Dk tolerance, copper weight, prepreg system, panel utilization & lead time. Contact PCBSync for a firm quotation.
| Material ↕ | Dk @10GHz ↕ | Df ↕ | Tg °C ↕ | CTE Z (ppm/°C) ↕ | Best For ↕ |
|---|
Click any column header to sort. Lower Dk = faster propagation & wider traces · lower Df = less signal loss · matched CTE = better thermal-cycling reliability.
Field-tested guidance for laying out and specifying Arlon RF and high-temperature boards.
Below 6 GHz, DiClad gives the best cost-performance. For 6–20 GHz reach for the AD series; above 20 GHz move to CLTE or CuClad for the lowest loss.
PTFE conducts heat poorly. Drop thermal vias (0.3 mm dia, 1 mm pitch) under power devices. TC-series laminates deliver 3–5× the thermal conductivity for hot nodes.
Arlon holds Dk ±0.04 vs ±0.2 for FR-4. Design to nominal Dk, allow ±5% impedance margin, and request lot impedance testing on production runs.
PTFE wants specialized bits at lower feed rates. Keep min via ≥ 8 mil and aspect ratio < 8:1. Use plasma desmear over wet-chemical for clean hole walls.
PTFE's higher CTE shifts etched geometry. Add +0.5 mil to trace widths and use trapezoidal trace models for accurate impedance above 10 GHz.
Route RF on Arlon cores, digital/power on FR-4 to cut cost. Bond with PTFE-compatible films (FEP or low-flow prepreg) for a reliable mixed-dielectric build.
ENIG gives the best fine-pitch solderability on PTFE. For lowest RF conductor loss use immersion silver or OSP; avoid HASL on thin (<10 mil) PTFE cores.
Keep laminates at <30 °C / <50% RH. PTFE barely absorbs moisture but contamination kills solder-mask adhesion — handle with gloves and pre-bake before HASL.
Arlon processing is close to FR-4 with a few critical differences. Here's the workflow PCBSync follows on Arlon jobs.
Climate-controlled storage, sealed/vacuum bags for polyimides. Softer laminates (25N/FR) need guide plates and ESD handling.
Brown-oxide inner layers, 30 min vacuum before heat, ramp 2–3 °C/min, then follow the resin-specific cure (85N runs hotter/longer than 33N/35N).
Polyimides drill on standard tooling. Remove smear with permanganate + plasma; PTFE benefits from plasma desmear for clean plating.
Accepts ENIG, immersion tin/silver, electrolytic tin and HASL. Pre-bake at 110 °C / 1 hr before HASL to drive out moisture.
Arlon runs ~2–5× FR-4 for electronic substrates and ~5–10× for microwave grades. A hybrid Arlon-RF / FR-4-digital stack-up is the usual way to balance cost and performance.
Meets relevant IPC-4101 slash sheets, RoHS & REACH, with UL flammability ratings (V-0/V-1/HB). 85N is common in MIL-PRF-31032 qualified, AS9100 aerospace builds.
Polyimides (33N/35N/85N, Tg 250 °C, Td 380–430 °C) sail through 260 °C reflow. For epoxies confirm Tg > 170 °C — 45N/49N/51N are built for lead-free.
Real-world programs where Arlon's electrical, thermal or reliability edge over FR-4 justifies the cost.
A quick decision matrix for when each material class makes sense.
| Factor | FR-4 | Arlon | Rogers |
|---|---|---|---|
| Cost | Lowest ($) | Medium ($$) | Highest ($$$) |
| Frequency | <1 GHz typ. | Up to 77+ GHz | Up to 100+ GHz |
| Tg Range | 130–180 °C | 135–250 °C | 280–350 °C |
| Processing | Standard | Similar to FR-4 | Special handling |
| Loss (Df) | 0.02–0.03 | 0.0009–0.01 | 0.0012–0.004 |
Operating below 1 GHz, standard temperatures, and cost is the primary driver.
You need better-than-FR-4 performance with easier processing than Rogers — high-temp, rigid-flex, or mid-cost RF.
You need absolute best-in-class RF performance at ultra-high frequencies or PTFE-specific properties.
Take these specs to a fabricator who runs Arlon AD, CLTE, DiClad, CuClad, TC and 85N every day. PCBSync handles RF & high-temperature boards end-to-end.
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