Engineering resources
Arlon PCB Applications
Choose materials against the environment and acceptance plan of your product. An application label is the start of a review, not a qualification result.
Industrial electronics
Document continuous and transient temperature, vibration, contamination and maintenance expectations. Review copper weight, connector loading and the electrical isolation required around power circuits. An approved epoxy or polyimide construction should match the actual duty cycle.
Avionics and aerospace electronics
Specify the program documentation, traceability and reliability tests with the fabrication package. Thermal cycling and plated-through-hole reliability should be reviewed with the full layer stack. Material supplier qualification does not automatically establish finished-board qualification.
Semiconductor test and burn-in
Include socket loads, repeated insertions, board flatness and thermal exposure time. Compare dimensional behavior and the consequences of repeated heating for vias and interconnections. Polyimide grades offer a useful starting point for a material review.
Medical electronics
Share device-level quality requirements and the approved material specification. Cleaning, insulation, traceability and assembly compatibility are project-specific. No laminate designation by itself establishes biocompatibility or suitability for implantation.
Space and satellite electronics
Define mission requirements for thermal cycling, vacuum, material documentation and any outgassing testing. Review the exact material construction and finish against the program specification before treating catalogue values as qualification evidence.
RF and microwave circuits
Specify operating bands, insertion-loss and phase budgets, reference planes and copper construction. Evaluate dielectric loss together with conductor roughness and connector transitions. Explore RF material models and retain the full grade suffix in the drawing.
Rigid-flex and selectively bonded assemblies
Mark bend regions, openings and allowed resin intrusion. Review bondline thickness and transitions with the flex design. Low-flow prepregs address resin movement; they do not replace a complete flex-life assessment.